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Intel Unveils New Tools in Its Advanced Chip Packaging Toolbox

  News: This week's Semicon West in San Francisco, Intel Engineering leaders provided an update to the advanced Intel packaging opportunities, and presented new building blocks, including the innovative emib and folding together and use a new connection technology (ODI). Combined with world-class processing technology Intel the ability to unlock new packaging innovations customers and delivers computer systems of tomorrow.   smoothtechi "Our vision is to develop the technology leadership technology for connecting chips and Chaklets in a package to match the functionality of a monolithic system, en-chips. Heterogeneous our approach provides unprecedented flexibility architects chip for mixing and combining IP blocks and process technology using different memory elements, and input / output of a new device form factors. Intel vertically integrated structure provides an advantage in an era of heterogeneous integration, which gives us an unparalleled ability to coordinate the ar

Intel announces node renaming and roadmap to the Angstrom era

 

The General Director of Intel Pat Gelsinger organized the global "Intel accelerated" last night last night. There are numerous outstanding aspects of the event for discussion, and in our title you can see that Intel announced plans for the new name of the node name, together using the route map to 2025+. Other interesting titbacks were on topics; Two new process technologies (RivBonfet and PowerVIA), a manual declared in 3D packaging (Omni Fover and Fover Rights Direct), and the Progress News for Intel Foundry Services (IFS) with Qualcomm is announced as the first important client.

No later than ADO, consider a new roadmap built above (click to enlarge). To the left, you can see where Intel is now, with pieces of surfaces of 10 nm, created by the mass. In his recent income statement, he said that its volume of 10 nm exceeded 14 nm to the above, so correctly present the current state with this node.

Superfine Intel improved 10 Nm was going to come on, and the processors that were going to use this process were the first lake chips of lakes for laptops and desktop computers. Now Alder Lake-P and -s chips will be described as Intel 7 'processors. If you follow the table, you will see that Intel confirms that Intel 7 will deliver a profit of 15-15 percent Perf / Watts, optimizing Fayer transistors and already in volume.

Intel admits a change chart with semiconductor quotes / scientific media

It is allowed further to the future in the future, Intel 4 (previously Intel 7NM) will be delivered by 20% predicted performance / watt, hold full use of EUV, and the first METEORE lake for customer processors is already recorded. Intel 3 continues with greater density, increased EUV use, decreases through resistance, and can count on Intel 3 products arising during or after H2 2023.

The latter, but no less important, in this road map Intel awaits innovations on the basis of the Intel 20A process on H1 2024. "A" means the entrance to the Angstrom Epoch, and if it continued on the XNM route, I continued it would be called 2 nm. In the presentation of the video, we have heard that Intel already has engineers who work in processors 18a for 2025.

Another important thing happens when Intel reaches the Angstrom era. Transistor innovation, such as Ribbonfet and PowerVia, must enter the game. Transistor innovations are much more involved than making smaller nodes, chip designers and foundries can use other technology for higher densities and other optimizations. Rigbonfet is the first new Intel Transistory technology from Fager, and its nanorbal structure has a door wrapped around the channel. Intel says that this allows you to increase the drive current in all stresses for greater performance. PowerVIA is the implementation of the Intel delivering the rear energy, optimizing the transmission of the signal by eliminating the need for energy routing on the front panel of the Wafers.

You probably have already heard about Intel Foveros packaging technology. Now Intel has advanced it with Omni Fover and Direct Fover. Foveros Omni "allows the disaggregation to die, mixing several tabs more than dies with several basic tiles through mixed stunning nodes." Meanwhile, direct accompaniment allows the tones of sub-10-micron stroke and claims that the limit between where the wafs end and where the package begins.

In addition to the previous technical news, Intel shared some of his recent business success from IFS. Qualcomm was registered in Fab, some of its future processor families in Intel 20A, which sounds like a great victory. Amazon AWS will use IFS for some of your duties on the servers chip packages.

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