Where Flavor Outshines Frugality In the bustling world of food blogs, "Love & Olive Oil" stands out like a sun-drenched trattoria amidst a neon fast-food chain. Lindsay and Taylor, the charming duo behind the blog, champion vibrant, budget-friendly cooking that embraces simplicity and unexpected twists. Forget bland beans and sad salads – their recipes sing with fresh flavors, clever ingredient hacks, and a contagious passion for creating culinary happiness in your kitchen. Their three cookbooks ("Feasting on a Budget," "One-Pot Wonders," and "Weeknight Wins") are testaments to their culinary philosophy. Each page bursts with dishes designed to inspire and delight, proving that impressive meals don't require a hefty bank account. Take their Pasta Puttanesca with Roasted Tomatoes and Cannellini Beans. Instead of pricey anchovies, they blitz sun-dried tomatoes with capers and olives, creating a rich, salty condiment that coats the p...
News: This week's Semicon West in San Francisco, Intel Engineering
leaders provided an update to the advanced Intel packaging opportunities, and
presented new building blocks, including the innovative emib and folding
together and use a new connection technology (ODI). Combined with world-class
processing technology Intel the ability to unlock new packaging innovations
customers and delivers computer systems of tomorrow.
"Our vision is to develop the technology leadership
technology for connecting chips and Chaklets in a package to match the
functionality of a monolithic system, en-chips. Heterogeneous our approach
provides unprecedented flexibility architects chip for mixing and combining IP
blocks and process technology using different memory elements, and input /
output of a new device form factors. Intel vertically integrated structure
provides an advantage in an era of heterogeneous integration, which gives us an
unparalleled ability to coordinate the architecture, process and packaging to
offer leading products. "
-Babak Sabi, corporate vice president of Intel, the
Assembly and the development of testing technology
Why it's important: packing chips has always played a
crucial role, if it is unrecognizable in the electronics supply chain. As a
physical interface between the processor and the motherboard package provides a
landing zone for electrical signals and power source of the chip. As the
electronics industry is converted into data-oriented data, advanced packaging
will play a much greater role than the one in the past.
More than just the final step in the manufacturing process,
the packaging becomes a catalyst for product innovation. The improved packaging
techniques allow the integration of different computational engines in several
processing techniques, with the same performance parameters to one dying, but
using the platform, which is much higher than the matrix size limit integration
only matrix. These technologies improve performance, power and area at the
product level, increasing rethinking complete system architecture.
What are the upgrade Intel: Intel is a leader in advanced
packaging technology, with current offerings, covering 2D and 3D approaches? In
Semichon West Intel introduced three new technologies that will open up a new
dimension in product architecture:
CO-EMIB: Intel Emib and electo Technologies advantage of
compounds of high density to provide high bandwidth at low power, to the input
/ output density to or better than the competitive approaches. The new joint
company's technology allows you to connect even more computing power and
performance. CO-EMIB allows to interlock two or more elements substantially
performance single chip. And designers can also connect analogues, memory and
other tiles with very high capacity and very low power.
ODI: Omnideenedal Interconnection provides even more
flexibility for communication between Chublets in the package. Upper chip can
communicate with other horizontally Chublets, similar to Emib. You can also
communicate vertically with silicone VIAS (TSV) based on the following grounds,
similar resistance. ODI and takes advantage of large vertical road to ensure
the delivery of energy to the upper matrix substrate directly from a pouch.
Much more than the traditional TSV, larger roads have less resistance,
providing a more reliable delivery of energy at the same time with greater
bandwidth and low latency, enabled through stacking. At the same time, this
approach reduces the amount of TSV, required at the bottom of a base, releasing
more active areas for transistors and optimization matrix size.
MDIO: Construction of its advanced interface (AIB) PHY-level
relationship, Intel described new MATRIX interface for skills called MDIO. The
technology allows a modular approach to system design with a library of IP
blocks Chiple. MDIO provides better power efficiency, and more than double the
speed and density of the passing bandwidth offered by AIB.
Together these technologies are complementary tools toolbar
powerful. In conjunction with the Intel technology processes they form the
basic palette for creation of chip architects, giving them the freedom to dream
of new products.